hardware (CSP) Surface Mount International attendees debated

chip scale technologies as system manufacturers seek new

levels of package miniaturisation for chip-on-board, flip chip

and multichip modules. Technical and marketing gurus

furthered the technical debate by focussing on which chip

scale packaging schemes would be the most cost-effective for

future packages designated for high volume consumer

applications. Bare chip package supporters noted that

mainstream circuitry is readily available in known good die

(KGD) from a number of suppliers. Traditional ball grid array

packages received strong support for current high volume and

high density manufacturing needs. Chip scale packages (CSP)

provide pre-speed-sorted,pre-tested and pre-packaged die

without requiring specialized testing. CSP supporters improved

their position with ChipScale's announcement that Motorola

will license its Micro SMT packaging technology.